| Issue |
MATEC Web of Conferences
Volume 8, 2013
Progress in Ultrafast Laser Modifications of Materials
|
|
|---|---|---|
| Article Number | 04011 | |
| Number of page(s) | 2 | |
| Section | Process characterization and some aspects of femtosecond laser direct writing | |
| DOI | https://doi.org/10.1051/matecconf/20130804011 | |
| Published online | 18 November 2013 | |
Optical Interference and Self-Scattering Effect On Laser Ablation of Thin Silicon Films
1 Debye Institute for Nanomaterials Science, Utrecht University, P. O. Box 80000, 3508 TA Utrecht, The Netherlands.
2 Department of Chemical Engineering and Materials Science, University of California, Davis.
* e-mail: h.zhang1@uu.nl
We report measurement of the ablation depth and self-reflectivity from thin silicon films illuminated by a single tightly focused femtosecond laser pulse. We show the dependence of ablation depth on incident laser pulse fluence can be modeled with a transfer-matrix method, taking into account transient reflectivity and light propagation in a stratified medium. We find optical interference effects in laser ablation of thin films are of crucial importance. Furthermore, We present the evidence of self-scattering effects due to the buildup of a three dimensional submicron sized plasma in the focal region.
© Owned by the authors, published by EDP Sciences, 2013
This is an Open Access article distributed under the terms of the Creative Commons Attribution License 2.0, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.